HDI&TEFLON
| HDI,TEFLON | ||||||
| Item | Specification | |||||
| Layers | 2L – 30 layers | |||||
| Materials | Conventional FR4, High frequency, High Speed | |||||
| Copper thickness | 1/4oz-20oz | |||||
| PCB thickness | 0.15mm – 6.0mm | |||||
| Maxinum dimensions | 1200mm x 600mm | |||||
| Surface finishes | HASL SNPB, HASL LF, OSP,Immersion Gold, Immersion Silver, Immersion Tin, Hard gold fingers, Electrolytic gold ,Carbon ink, Peelable mask,etc | |||||
| Special Technical | HDI,Buried/blind vias,hybrided materials PCB, Countersink hole,backplane, copper/resin via plagged,heavy copper, Impedance control,etc. | |||||
